We Have More Than 40 Years of Experience. [email protected]
Blog Center
  1. Home >
  2. Blog >
  3. Ball Mill

Wafer Grinding Introduction

We are here for your questions anytime 24/7, welcome your consultation.

Get Price
Wafer Grinding Introduction

process step. At wafer back grinding, BG tape serves as a cushion and ensures that wafers are properly vacuumed throughout the process. Once the target wafer thickness was achieved, the wafer then proceeds to wafer mounting process. The grinded wafer is mounted onto a dicing tape or Dicing Die Attach Film (DDAF) and ring frame

Relate Blog

toTop
Click avatar to contact us
Hi,may I help you with products, price, etc?
Chat Online